1. 34mm Module:
   • Utilizes fully welded technology, Cu substrate with low thermal resistance AIN insulating ceramics.
   • High power density, low parasitic inductance, and low switching loss.
   • Suitable for high-temperature, high-frequency applications.
2. DWC3 Module:
   • Uses advanced vacuum soldering technology, ASIC substrate with low thermal resistance AIN insulating ceramics, and operates up to 175°C.
   • Features third-generation low parasitic inductance design (less than 10nH), reducing switching loss by over 50% compared to existing modules.
   • Suitable for high-temperature, high-frequency, and ultra-low switching loss applications.
   • Integrated NTC temperature sensor, facilitating system integration.
3. EasyPACK Module:
   • Employs advanced vacuum soldering technology, Al2O3 insulating ceramics, and operates up to 150°C.
   • High power density, low parasitic inductance, and low switching loss.
   • Suitable for high-temperature, high-frequency applications.
   • Integrated NTC temperature sensor, making system integration easier.

These power modules are optimized for high-performance applications, with a focus on minimizing switching losses, managing high temperatures, and improving system integration.